heat generating device
- Examples
Due to its increased mobility prior to cure, Gap Filler can fill small air voids, crevices, and holes, reducing overall thermal resistance to the heat generating device. | Debido a su mayor movilidad antes del curado, estos materiales pueden llenar pequeños espacios de aire, grietas y orificios, lo que reduce la resistencia térmica general al dispositivo generador de calor. |
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